GRGT waxay bixisaa falanqaynta jirka burburisa (DPA) ee qaybaha daboolaya qaybaha dadban, aaladaha kala duwan iyo wareegyada isku dhafan.
Nidaamyada semiconductor ee horumarsan, awoodaha DPA waxay dabooshaa jajabyada ka hooseeya 7nm, dhibaatooyinka waxaa lagu xiri karaa lakabka chip-ka gaarka ah ama um range; qaybaha hawo-xidhida heerka hawada hawada oo leh shuruudaha xakamaynta uumiga biyaha, heerka PPM ee falanqaynta halabuurka uumiga biyaha gudaha ayaa la samayn karaa si loo hubiyo isticmaalka gaarka ah ee qaybaha xidhidhiyaha hawada.
Chips wareeg ah oo isku dhafan, qaybaha elektiroonigga ah, qalabka discrete, qalabka elektiroonigga ah, fiilooyinka iyo isku xirka, microprocessors, qalabka macquulka ah ee barnaamijka, xusuusta, AD/DA, isdhexgalka baska, wareegyada guud ee dhijitaalka ah, dareemaha analooga, qalabka analooga ah, qalabka microwave, sahayda korontada, iwm.
● GJB128A-97 Qaabka tijaabada aaladda semiconductor discrete
● GJB360A-96 qalabka elektarooniga iyo korantada habka tijaabada
● GJB548B-2005 hababka iyo hababka tijaabada qalabka Microelectronic
● GJB7243-2011 Shuruudaha Farsamo ee Baadhista ee Qalabka Elektarooniga ah ee Milatariga
● GJB40247A-2006 Habka Falanqaynta Jirka Burburinta ee Qalabka Elektarooniga ah ee Milatariga
QJ10003—2008 Hagaha Baadhista ee Qaybaha La Soo Dedejiyay
● MIL-STD-750D habka tijaabada qalabka semiconductor discrete
● MIL-STD-883G habab iyo habraacyada tijaabada qalabka microelectronic
Nooca tijaabada | Walxaha tijaabi |
Alaabooyinka aan burburin | Kormeerka aragga dibadda, raajada, PIND, shaabadeynta, awoodda meesha laga saarayo, kormeerka mikroskoob ee dhawaaqa |
Shayga wax dumiya | Laser de-capsulation, kiimikaad e-capsulation, falanqaynta ka kooban gaaska gudaha, kormeerka aragga gudaha, kormeerka SEM, xoogga isku xidhka, xiirid xoogga, xoogga xabagta, chip delamination, kormeerka substrate, dheehidda isku xirka PN, DB FIB, ogaanshaha dhibco kulul, ogaanshaha booska daadinta, ogaanshaha godad, imtixaanka ESD |